Our Services

Physical and electrical characterization

Our laboratories are equipped with advanced measurement and analysis technologies and setups for the physical and electrical characterization of devices and systems. You can contract our characterization and analysis services as part of your technological development or production order, or independently to test your own samples and verify their quality.

info@dtm.es

+34 935947700 ext. 435527

ELECTRICAL CHARACTERIZATION

The IMB-CNM laboratories have numerous instruments available for performing:

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Parametric tests
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Design and characterization of test structures
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Configuration of new measurement techniques on wafers
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Characterization of electronic devices

ELECTROTHERMAL CHARACTERIZATION AND FAILURE ANALYSIS

Advanced measurements based on optical methods (infrared and thermoreflectance thermography, internal infrared laser detection) have been implemented for precise electrothermal characterization at the chip or system level. The synchronous detection method applied to infrared thermography allows for the analysis of reliability limits in advanced power systems and devices (high temperature, wide band gap). Applications: • Study of modulated heat sources for the non-invasive evaluation of structural defects.

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Extraction of figures of merit (FoM) at the frequency of internal nodes of integrated circuits/devices
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Non-invasive hotspot detection for debugging integrated circuits and power devices
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Robustness studies and failure analysis in power devices (Si, SiC)

NANOSCALE CHARACTERIZATION

The instrumentation in the cleanroom and adjoining laboratories allows for:

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Characterization using AFM: topographic, electrical, magnetic…
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SEM imaging (nanoscale resolution) and EDX material characterization
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Cross-sectioning with FIB, sample preparation for TEM
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In situ electrical characterization (3 nanoprobes and a 50-pin connector on the SEM camera) and EBIC images

REVERSE ENGINEERING

Our reverse engineering experts possess in-depth knowledge of semiconductor technology, manufacturing processes, and integrated circuit design, which, combined with access to the IMB-CNM's state-of-the-art cleanroom equipment, allows us to: We offer a wide range of chip analysis services, including:

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Patent protection
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Failure analysis
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Security audits
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Reverse engineering tasks, which include:

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Technological analysis
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Analog circuit extraction
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Digital circuit extraction

DO YOU NEED MORE INFORMATION?

Visit the Reverse Engineering Lab website and contact us.

Reverse Engineering Laboratory

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Carrer dels Til·lers, UAB Campus, Cerdanyola del Vallès, 08193 Barcelona, Spain

+34 935947700 ext.435527

info@dtm.es